Applied Materials
Applied Materials Unveils Advanced Packaging Initiative, Reshaping the Future of Chip Performance and Cost
Applied Materials (NASDAQ: AMAT) has launched its groundbreaking "EPIC Advanced Packaging" initiative, a strategic expansion of its global Equipment and Process Innovation and Commercialization platform. Unveiled in November 2024, this collaborative model is set to accelerate the development and commercialization of next-generation chip packaging solutions, directly addressing the